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Study on Electrochemical and electrical discharge compound Micro-machining for Silicon

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成果类型:
期刊论文、会议论文
作者:
Chen, Hui*;Shi, Lei
通讯作者:
Chen, Hui
作者机构:
[Chen, Hui] Cent South Univ Forestry & Technol, Coll Mech & Elect Engn, Changsha 410004, Peoples R China.
[Shi, Lei] Cent South Univ Forestry & Technol, Informat Ctr, Changsha 410004, Peoples R China.
通讯机构:
[Chen, Hui] C
Cent South Univ Forestry & Technol, Coll Mech & Elect Engn, Changsha 410004, Peoples R China.
语种:
英文
期刊:
IOP Conference Series: Materials Science and Engineering
ISSN:
1757-8981
年:
2019
卷:
563
期:
2
页码:
144-149
会议名称:
第二届先进电子材料、计算机与材料工程国际学术会议(AEMCME 2019)
会议论文集名称:
Proceedings of 2019 2nd International Conference on Advanced Electronic Materials, Computers and Materials Engineering(AEMCME 2019)
会议时间:
2019-04-19
会议地点:
中国湖南长沙
会议主办单位:
[Chen, Hui] Cent South Univ Forestry & Technol, Coll Mech & Elect Engn, Changsha 410004, Peoples R China.^[Shi, Lei] Cent South Univ Forestry & Technol, Informat Ctr, Changsha 410004, Peoples R China.
出版地:
DIRAC HOUSE, TEMPLE BACK, BRISTOL BS1 6BE, ENGLAND
出版者:
IOP PUBLISHING LTD
基金类别:
Youth Fund Project of Central South Forestry University of Science and Technology [QJ2012011A]
机构署名:
本校为第一且通讯机构
院系归属:
机电工程学院
摘要:
Abstract Silicon material is a widely used substrate in micro-electromechanical systems, and its micro-fabrication technology has always been a research hotspot. The main microfabrication methods of silicon material are chemical etching, electrochemical machining (ECM) and electrical discharge machining (EDM). The electrochemical and electrical discharge compound machining technology is a kind of machining method for non-conductive materials. In this paper, the compound machining technology was studied and applied to the microfabrication of silicon material. The machining principle of silicon...

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