期刊论文

Electroless gold plating on printed circuit board in potassium gold(I) thiocyanate bath

中文

电镀与涂饰

1004-227X

2017

36

7

357-360

10.19289/j.1004-227x.2017.07.005

20976201:国家自然科学基金 07JJ6156:湖南省自然科学基金 2004184:国家教委留学回国人员资助项目

本校为第一机构

以硫氰酸亚金钾[KAu(SCN)_2]为金源对镀镍印制线路板进行化学镀金。采用单因素试验研究了镀液中Au~+含量、硫氰酸铵含量、pH和温度对沉金速率、金层外观和结合力的影响,得到最优配方和工艺参数为:Au~+2.0g/L,硫氰酸铵15g/L,添加剂 Cy-808 150 mL/L, pH 3.0,温度50 ℃。在此条件下沉金速率约为6 nm/min,结晶均匀细致,呈光亮的金黄色。

Electroless gold plating was conducted on the surface of nickel-plated printed circuit board using potassium gold(I) thiocyanate [KAu(SCN)_2] as main salt. The effects of Au~+ and ammonium thiocyanate contents, as well as pH and temperature of the bath on deposition rate, appearance and adhesion of gold coating were studied by single-factor experiment. The optimal bath composition and process parameters were obtained as follows: Au~+ 2.0 g/L, ammonium thiocyanate 15 g/L, additive Cy-808 150 mL/L, temperature 50 ℃, and pH 3.0. The gold depositi...