Curing dynamics of soy flour-based adhesives enhanced by waterborne polyurethane

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期刊论文

作者：

Wang, Yong;Li, Xianjun;Lou, Wanli;Deng, Layun;Fan, Youhua*

通讯作者：

Fan, Youhua

作者机构：

[Deng, Layun; Fan, Youhua; Wang, Yong] Hunan Acad Forestry, Key Lab, State Forestry Adm Utilizat Sci Southern Woody Oi, Changsha, Hunan, Peoples R China.

[Li, Xianjun; Wang, Yong] Cent South Univ Forestry & Technol, Coll Mat Sci & Engn, Changsha, Hunan, Peoples R China.

[Lou, Wanli] Minist Sci & Technol, Torch High Technol Ind Dev Ctr, Beijing, Peoples R China.

通讯机构：

[Fan, Youhua] H

Hunan Acad Forestry, Key Lab, State Forestry Adm Utilizat Sci Southern Woody Oi, Changsha, Hunan, Peoples R China.

语种：

英文

关键词：

Activation energy;Curing;Fourier transform infrared spectroscopy;Polyurethanes;Thermogravimetric analysis;Apparent activation energy;Defatted soy flours;Modified soy flours;Preexponential factor;Structure characteristic;Thermo-gravimetric;Waterborne Polyurethane;Waterborne polyurethanes;Adhesives

期刊：

International Journal of Polymer Science

ISSN：

1687-9422

年：

2019

卷：

2019

期：

页码：

1-7

DOI：

10.1155/2019/2916759

基金类别：

This work is supported by the grant from Major Science and Technology Special Project in Hunan (2017NK1010) and Forestry Science and Technology Demonstration Project Funds of Central Finance (2016[XT] 006).

机构署名：

本校为其他机构

院系归属：

材料科学与工程学院

摘要：

In this paper, thermogravimetric (TG) analysis was carried out to make clear the curing properties of soy flour-based adhesives (SFAs) enhanced by waterborne polyurethane (WPU) with different addition levels. The kinetic parameters were evaluated by a thermal dynamics method, including activation energy and preexponential factor. In addition, the structure characteristics of both soy flour and modified soy flour-based adhesives were tested by Fourier transform infrared spectroscopy (FTIR). The results revealed that the FTIR spectra of pristine ...

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Curing dynamics of soy flour-based adhesives enhanced by waterborne polyurethane

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