With wheat straw and wood chips as raw materials, three-layer particleboard was made with Mg-based inorganic adhesive. Effects of wheat straw/wood ratio, board density, hot-pressing time and temperature on physical and mechanical properties of the board samples were studied. Results showed that modulus of rupture(MOR), modulus of elasticity(MOE) and thickness swelling(TS) gradually decreased and internal bond strength(IB) gradually increased with increasing the wheat straw in the wheat straw/wood ratio. As board density increased and ho...